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Intel Launches First IDM 2.0 Global Chip Fab Assault Breaking Ground On Two Arizona Plants

  • Sep 25 / 2021
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Intel Launches First IDM 2.0 Global Chip Fab Assault Breaking Ground On Two Arizona Plants

Intel Launches First IDM 2.0 Global Chip Fab Assault Breaking Ground On Two Arizona Plants
All the world’s chip giants are rushing to increase fab capacity as shortages rock multiple industries. Although Taiwan Semiconductor (TSMC) is the largest contract chipmaker, Intel is moving to beef up its fabs. And best of all, the company is expanding right here in the United States.
Intel today broke ground on two new “leading-edge” chip

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