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Intel Has Reportedly Cornered TSMC 3nm Chip Capacity To Feed Next Gen Xeon And GPU Demand

  • Aug 14 / 2021
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Intel Has Reportedly Cornered TSMC 3nm Chip Capacity To Feed Next Gen Xeon And GPU Demand

Intel Has Reportedly Cornered TSMC 3nm Chip Capacity To Feed Next Gen Xeon And GPU Demand
When Pat Gelsinger stepped into the role of CEO of Intel, replacing Bob Swan at the helm, he outlined a plan to restore Intel’s leadership in its fab process technologies. He also made clear that Intel would tap third-party foundries, where it makes sense to do that, and it appears as though Intel will be a major customer of TSMC’s 3-nanometer

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