{"id":8934,"date":"2019-07-11T08:00:25","date_gmt":"2019-07-11T08:00:25","guid":{"rendered":"http:\/\/howk.de\/w1\/intel-unveils-new-chip-packaging-tech-to-fuel-its-next-gen-processor-designs\/"},"modified":"2019-07-11T08:00:25","modified_gmt":"2019-07-11T08:00:25","slug":"intel-unveils-new-chip-packaging-tech-to-fuel-its-next-gen-processor-designs","status":"publish","type":"post","link":"https:\/\/howk.de\/?p=8934","title":{"rendered":"Intel Unveils New Chip Packaging Tech To Fuel Its Next-Gen Processor Designs"},"content":{"rendered":"

\"Intel<\/a>
\nWe are in the era of chiplet designs, and given the growing complexity of today’s silicon solutions, that is unlikely to change anytime soon. Along those lines, one thing Intel says often gets overlooked is the chip packaging on modern designs. As such, Intel is showcasing a new three-dimensional chip packaging technique that essentially combines <\/p>\n","protected":false},"excerpt":{"rendered":"

We are in the era of chiplet designs, and given the growing complexity of today’s silicon solutions, that is unlikely to change anytime soon. Along those lines, one thing Intel says often gets overlooked is the chip packaging on modern designs. As such, Intel is showcasing a new three-dimensional chip packaging technique that essentially combines<\/p>\n","protected":false},"author":1,"featured_media":0,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[13],"tags":[],"yoast_head":"\nIntel Unveils New Chip Packaging Tech To Fuel Its Next-Gen Processor Designs - Howk IT-Dienstleistungen<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/howk.de\/?p=8934\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Intel Unveils New Chip Packaging Tech To Fuel Its Next-Gen Processor Designs - Howk IT-Dienstleistungen\" \/>\n<meta property=\"og:description\" content=\"We are in the era of chiplet designs, and given the growing complexity of today’s silicon solutions, that is unlikely to change anytime soon. Along those lines, one thing Intel says often gets overlooked is the chip packaging on modern designs. As such, Intel is showcasing a new three-dimensional chip packaging technique that essentially combines\" \/>\n<meta property=\"og:url\" content=\"https:\/\/howk.de\/?p=8934\" \/>\n<meta property=\"og:site_name\" content=\"Howk IT-Dienstleistungen\" \/>\n<meta property=\"article:publisher\" content=\"https:\/\/www.facebook.com\/howk.de\" \/>\n<meta property=\"article:published_time\" content=\"2019-07-11T08:00:25+00:00\" \/>\n<meta property=\"og:image\" content=\"https:\/\/hothardware.com\/ContentImages\/NewsItem\/48652\/thumbnail\/default\/IntelChipPackageThumbnail.jpg\" \/>\n<meta name=\"author\" content=\"admin\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:label1\" content=\"Written by\" \/>\n\t<meta name=\"twitter:data1\" content=\"admin\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\/\/schema.org\",\"@graph\":[{\"@type\":\"Article\",\"@id\":\"https:\/\/howk.de\/?p=8934#article\",\"isPartOf\":{\"@id\":\"https:\/\/howk.de\/?p=8934\"},\"author\":{\"name\":\"admin\",\"@id\":\"https:\/\/howk.de\/#\/schema\/person\/b029bd02d4f35dce869ef54c81a100c5\"},\"headline\":\"Intel Unveils New Chip Packaging Tech To Fuel Its Next-Gen Processor Designs\",\"datePublished\":\"2019-07-11T08:00:25+00:00\",\"dateModified\":\"2019-07-11T08:00:25+00:00\",\"mainEntityOfPage\":{\"@id\":\"https:\/\/howk.de\/?p=8934\"},\"wordCount\":67,\"commentCount\":0,\"publisher\":{\"@id\":\"https:\/\/howk.de\/#organization\"},\"articleSection\":[\"Hi Tech\"],\"inLanguage\":\"en-US\",\"potentialAction\":[{\"@type\":\"CommentAction\",\"name\":\"Comment\",\"target\":[\"https:\/\/howk.de\/?p=8934#respond\"]}]},{\"@type\":\"WebPage\",\"@id\":\"https:\/\/howk.de\/?p=8934\",\"url\":\"https:\/\/howk.de\/?p=8934\",\"name\":\"Intel Unveils New Chip Packaging Tech To Fuel Its Next-Gen Processor Designs - Howk IT-Dienstleistungen\",\"isPartOf\":{\"@id\":\"https:\/\/howk.de\/#website\"},\"datePublished\":\"2019-07-11T08:00:25+00:00\",\"dateModified\":\"2019-07-11T08:00:25+00:00\",\"breadcrumb\":{\"@id\":\"https:\/\/howk.de\/?p=8934#breadcrumb\"},\"inLanguage\":\"en-US\",\"potentialAction\":[{\"@type\":\"ReadAction\",\"target\":[\"https:\/\/howk.de\/?p=8934\"]}]},{\"@type\":\"BreadcrumbList\",\"@id\":\"https:\/\/howk.de\/?p=8934#breadcrumb\",\"itemListElement\":[{\"@type\":\"ListItem\",\"position\":1,\"name\":\"Home\",\"item\":\"https:\/\/howk.de\/\"},{\"@type\":\"ListItem\",\"position\":2,\"name\":\"Intel Unveils New Chip Packaging Tech To Fuel Its Next-Gen Processor Designs\"}]},{\"@type\":\"WebSite\",\"@id\":\"https:\/\/howk.de\/#website\",\"url\":\"https:\/\/howk.de\/\",\"name\":\"Howk IT-Dienstleistungen\",\"description\":\"Howk IT Services - Howk IT-Dienstleistungen\",\"publisher\":{\"@id\":\"https:\/\/howk.de\/#organization\"},\"potentialAction\":[{\"@type\":\"SearchAction\",\"target\":{\"@type\":\"EntryPoint\",\"urlTemplate\":\"https:\/\/howk.de\/?s={search_term_string}\"},\"query-input\":\"required name=search_term_string\"}],\"inLanguage\":\"en-US\"},{\"@type\":\"Organization\",\"@id\":\"https:\/\/howk.de\/#organization\",\"name\":\"HowK\",\"url\":\"https:\/\/howk.de\/\",\"logo\":{\"@type\":\"ImageObject\",\"inLanguage\":\"en-US\",\"@id\":\"https:\/\/howk.de\/#\/schema\/logo\/image\/\",\"url\":\"https:\/\/howk.de\/w1\/wp-content\/uploads\/2013\/12\/howk-logo.png\",\"contentUrl\":\"https:\/\/howk.de\/w1\/wp-content\/uploads\/2013\/12\/howk-logo.png\",\"width\":170,\"height\":170,\"caption\":\"HowK\"},\"image\":{\"@id\":\"https:\/\/howk.de\/#\/schema\/logo\/image\/\"},\"sameAs\":[\"https:\/\/www.facebook.com\/howk.de\",\"http:\/\/de.linkedin.com\/in\/howkde\"]},{\"@type\":\"Person\",\"@id\":\"https:\/\/howk.de\/#\/schema\/person\/b029bd02d4f35dce869ef54c81a100c5\",\"name\":\"admin\",\"image\":{\"@type\":\"ImageObject\",\"inLanguage\":\"en-US\",\"@id\":\"https:\/\/howk.de\/#\/schema\/person\/image\/\",\"url\":\"https:\/\/secure.gravatar.com\/avatar\/b5a20f4d07bca1b73f25cff58a1116c4?s=96&d=mm&r=g\",\"contentUrl\":\"https:\/\/secure.gravatar.com\/avatar\/b5a20f4d07bca1b73f25cff58a1116c4?s=96&d=mm&r=g\",\"caption\":\"admin\"},\"url\":\"https:\/\/howk.de\/?author=1\"}]}<\/script>\n<!-- \/ Yoast SEO plugin. -->","yoast_head_json":{"title":"Intel Unveils New Chip Packaging Tech To Fuel Its Next-Gen Processor Designs - Howk IT-Dienstleistungen","robots":{"index":"index","follow":"follow","max-snippet":"max-snippet:-1","max-image-preview":"max-image-preview:large","max-video-preview":"max-video-preview:-1"},"canonical":"https:\/\/howk.de\/?p=8934","og_locale":"en_US","og_type":"article","og_title":"Intel Unveils New Chip Packaging Tech To Fuel Its Next-Gen Processor Designs - Howk IT-Dienstleistungen","og_description":"We are in the era of chiplet designs, and given the growing complexity of today’s silicon solutions, that is unlikely to change anytime soon. 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