AMD Milan-X Enterprise CPUs With X3D Stacked Die Tech Rumored In Development
It was a little over a year ago when AMD somewhat casually mentioned a new X3D packaging scheme that combines chiplets featuring a hybrid 2.5D and 3D die stacking design, and now rumor has it this could be what underpins a specialized server CPU codenamed Milan-X. The rumor also suggests it could be arriving relatively soon, rather than years